含疏水性液体微胶囊复合铜镀层的制备与性能研究  

Preparation and Performence of Composite Copper Coating with Hydrophobic Liquid Microcapsule

作　　者：李西娟[1] 李澄[1] 王加余[1] 张学德[1] 尹成勇[1] 郑顺丽[1] 徐云玲[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《中国腐蚀与防护学报》2013年第4期311-316,共6页Journal of Chinese Society For Corrosion and Protection

摘　　要：采用水相分离法制备了以甲基硅油为囊芯、聚乙烯醇为囊壁的疏水性液体微胶囊,并以其作为电沉积组分,研究渐变电流密度下的复合铜镀层电沉积工艺,对所制备的复合铜镀层表面微观形貌和疏水性进行表征,同时考察镀层在酸性腐蚀环境下对基体的保护效果。结果表明,所制备的含液体微胶囊复合铜镀层较纯铜镀层结晶更加致密;H2O在其表面的润湿性下降,接触角从90°增大至131°;复合镀层在1%(质量分数)H2SO4溶液中的自腐蚀电流密度较纯铜镀层降低3个数量级,自腐蚀电位由-0.63 V正移至-0.27 V,显示出良好的耐蚀性。Liquid microcapsule was prepared by using the phase separation method. Polyvinyl alcohol （PVA） and methyl silicone oil were used as the shell and core materials of microcapsule, respectively, and then co-deposition was executed through a graded current density on the surface of Fe substrate. The field emission scanning electron microscope （FE-SEM）, contact angle of distilled water and potentiodynamic polarization were applied to characterize the micro- morphology, wettability and corrosion resistance between two different electroplatings. The experimental results showed that the liquid microcapsule was incorporated into the co-deposition films, and it led to the change of contact angle from 90° to 131°. The co-deposition film exhibited better corrosion resistance than ordinary Cu coating and its corrosion current density decreased by three orders of magnitude in 1% （mass fraction） H2SO4 solution. The corrosion potential shifted positively from -0.63 to -0.27 V.

关 键 词：复合电镀 液体微胶囊 铜镀层 疏水性 耐腐蚀性 

分 类 号：TG174.4[金属学及工艺—金属表面处理]