Mo-Cu合金的研究进展  

RESEARCH PROGRESS OF Mo-Cu ALLOY

作　　者：夏明星[1] 张军良[1] 郑欣[1] 王东辉[1] 白润[1] 蔡小梅[1] 

机构地区：[1]西北有色金属研究院,陕西西安710016

出　　处：《中国钼业》2013年第4期34-37,共4页China Molybdenum Industry

摘　　要：Mo-Cu合金具有高的导热系数和低的线膨胀系数,被广泛应用于电触头材料、热沉材料、电子封装材料等。本文介绍了Mo-Cu合金的制备方法,以及提高Mo-Cu合金的致密化的方法,指出了Mo-Cu合金现在存在的问题及发展趋势。As the high thermal conductivity,the low coefficient of thermal expansion, Mo - Cu alloy is widely used in electrical contact material, heat sink material and sealing material to ceramics, and etc. Preparation method and the process of densification are described. The problems in production are discussed , and the development trend is also surveyed.

关 键 词：Mo—Cu合金 制备方法 致密化 

分 类 号：TG146.412[一般工业技术—材料科学与工程]