缓冲剂对Ni-P-SiC化学复合镀层的影响研究  

Impact of Buffer Agent on Chemical Composite Plating of Ni-P-SiC

作　　者：窦彩虹[1] 苌清华[1] 龚俊举[1] 高兆鑫[1] 

机构地区：[1]河南科技大学材料学院,河南洛阳471003

出　　处：《南方金属》2013年第5期12-14,共3页Southern Metals

基　　金：河南科技大学青年科学基金(2011QN40);河南科技大学大学生训练计划(2013028)

摘　　要：研究了镀液中缓冲剂浓度对铝合金表面化学复合镀层的影响,通过测定镀速、扫描电流、能谱分析、电化学工作站研究缓冲剂对镀速、镀层形貌、镀层中主要元素的含量的影响以及耐腐蚀性分析.实验表明当缓冲剂的浓度为14g/L镀速适宜,镀层表面SiC微粒分布最为均匀、细致,含硅量达到最大,耐腐蚀性最好.the influence of the concentration of buffer agent in plating solution on the aluminum alloy surface of the chemi- cal composite coating is studied. By means of determining the plating speed, electrochemical workstation, scanning cur-rent, energy spectrum analysis, the influence of the buffer agent on the plating speed, coating morphology, the content of main elements in the coating, and the corrosion resistance were investigated. Experiments show that when the concentration of the buffer agent reaches to 14 g/L rate, the plating speed is appropriate, which gives a perfect coating surface with fine SiC particles distributed evenly, maximum silicon content and best corrosion resistance.

关 键 词：缓冲剂 Ni—P—SiC 镀速 镀层 耐腐蚀性 

分 类 号：TQ153.2[化学工程—电化学工业]