极板厚度对电容边缘效应影响的理论和仿真分析  

Simulation and Analysis of the Influence of Plate Thickness on Capacitive Edge Effect

作　　者：雷建华[1] 

机构地区：[1]暨南大学信息技术研究所,广州广东510075

出　　处：《电脑与电信》2013年第8期52-53,55,共3页Computer & Telecommunication

摘　　要：理论分析了极板厚度对电容边缘效应的影响,并利用ANSYS有限元仿真软件分析平行板电容器的电磁场分布。研究发现,理论分析和仿真结果非常吻合,边缘效应随着极板厚度的增大而增大。因此,在实际设计中,需要在工艺的可行性基础上,尽可能减小极板厚度,既可以节省材料又能减小边缘效应带来的影响。The influence of plate thickness on capacitor edge effect is analyzed theoretically, and then the electromagnetic field distribution of parallel plate capacitor is simulated with the software of ANSYS. The results show that the theoretical analysis agrees well with simulations. The capacitor effect increases as the thickness increasing. Therefore, it is necessary to reduce the plate thickness in the real design, in order to save the cost of materials and reduce the edge effect as well.

关 键 词：平行板电容器 边缘效应 极板厚度 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]