Cu-W、Cu-Mo薄膜的微观结构及显微硬度分析  

Analysis on Microstructure and Microhardness of Cu-W,Cu-Mo Thin Film

作　　者：王丽[1] 郭诗玫[1] 周应强[1] 朱志军[1] 周铖[2] 刘国涛[2] 

机构地区：[1]曲靖师范学院物理与电子工程学院,云南曲靖655011 [2]昆明理工大学云南省新材料制备与加工重点实验室,云南昆明650093

出　　处：《云南冶金》2013年第4期46-49,63,共5页Yunnan Metallurgy

基　　金：曲靖师范学院实验教学研究项目(syjx2011003)

摘　　要：采用磁控共溅射方法分别制备了含有W和Mo两种不同成分的铜系薄膜,用EDX、XRD、SEM和纳米压痕仪对薄膜成份、结构、形貌和显微硬度进行了分析。结果表明,制备出的Cu-W和Cu-Mo薄膜均呈晶态结构,Cu-W和Cu-Mo形成了均匀的固溶体;经650℃热处理1 h后,Cu-W和Cu-Mo薄膜中晶粒长大,有富W和富Mo相从基体Cu相中弥散析出;Cu-W薄膜的显微硬度随W成分的增加先增加后降低;Cu-Mo薄膜的显微硬度随Mo成分的增加而持续升高,薄膜退火态的显微硬度低于沉积态。分析认为,以上结果的产生均因添加W、Mo所引起的晶粒细化效应和薄膜的热稳定性较差所致。The two kinds of copper thin films with W or Mo are prepared by magnetron co - sputtering method, the composition, structure, morphology and microhardness of thin films is analyzed by EDX, XRD, SEM and nanometer indentation testers. The results show that the prepared Cu-W and Cu-Mo thin film all present crystalline state structure, Cu-W and Cu-Mo forms uniform solid solution; the grains in Cu-W and Cu-Mo thin film grow up after the heat treatment for one hour at 650~C , there is enriched W and Mo phase precipitated dispersively from the host Cu phase; the microhardness of Cu-W thin film is increased and then decreased along with the increasing of W; the microhardness of Cu-Mo thin fihn constantly rise along with the increasing of Mo, the microhardness of annealed thin film is lower than as-deposited thin film. The analysis show that the reasons for the above results are caused by addition of W, Mo, which leads to grain refine- ment effect and poor thermal stability of the thin fihn.

关 键 词：Cu—W薄膜 Cu—Mo薄膜 微观结构 硬度 

分 类 号：TG113.12[金属学及工艺—物理冶金]