基于PDP扫描驱动芯片的LQFP封装热特性研究  

Investigation into the LQFP Thermal Characteristics Based on PDP Scan Driver ICs

作　　者：于冰[1] 张頔[1] 刘斯扬[1] 孙伟锋[1] 

机构地区：[1]东南大学国家专用集成电路系统工程技术研究中心,南京210096

出　　处：《电子器件》2013年第4期437-442,共6页Chinese Journal of Electron Devices

基　　金：江苏省自然科学基金项目(BK2011059);新世纪优秀人才支持计划项目(NCET-10-0331)

摘　　要：研究了LQFP封装的96路等离子平板显示(PDP)扫描驱动芯片的封装热特性,利用有限元法对所建立的封装模型进行数值求解,并与实测结果进行比较,验证了模型求解的可靠性与准确性。研究表明,在集成电路封装设计中,增大散热基板面积、优化引线框架、提高封装热导率,对于散热性能的提高非常有效,而在外围设计中,增大印制电路板(PCB)有效覆铜面积、增加PCB有效过孔数、在芯片顶部添加散热片、加大空气流速都可使芯片散热能力显著增强。Investigation into the thermal characteristics of 96 outputs PDP（ Plasma Display Panel）scan diver ICs has been carried out, using finite element method to obtain numerical solution of the established package model. Compared with the measured results, it verifies the reliability and accuracy of the model. The research shows that, in the package design of ICs, expanding the area of die pad, optimizing the shape of lead frame and increasing thermal conductivity of the package contribute to the improvement of chip cooling performance. In the peripheral circuit design, increasing the efficient area of copper, number of via holes of PCB （ Printed Circuit Board）, air velocity, and adding a heat Sink mounted on the top of chip are all efficient means, which can enhance the capability of chip cooling significantly.

关 键 词：LQFP封装 热特性 有限元法 PDP扫描驱动芯片 

分 类 号：TB482[一般工业技术—包装工程]