高酸低铜酸性镀铜溶液中添加剂对微盲孔填充效果的影响  

Effect of Additives on the Copper Filling Microvia in an High Acid and Low Copper Plating Solution

作　　者：姚龙杰[1] 路旭斌[1] 任少军[1] 王增林[1] 

机构地区：[1]陕西师范大学化学化工学院应用表面与胶体化学教育部重点实验室,陕西西安710062

出　　处：《电镀与精饰》2013年第8期15-20,共6页Plating & Finishing

摘　　要：在电镀铜填充微盲孔的高酸、低铜酸性镀铜溶液中,以旋转圆盘电极为辅助,通过恒电流计时电位法对不同转速下,不同添加剂浓度的电镀铜溶液阴极电位及电位差的测定,研究了在高酸、低铜酸性镀铜溶液中通过电位差的大小来指导微盲孔填充的方法,发现该方法在对于高深径比的微盲孔填充时存在一定的局限性。通过改善电镀参数实现了对d为100μm,深度为100μm的微盲孔的完全填充。In this paper, the cathodic potential and potential difference of copper rotating disk electrode in acidic plating solution were measured by chronopotentiometry mehtod under different rotating speeds and additives＂ concentration. The relation between the potential differences and filling performance was inves- tigated. The results indicated that the potential differences could not be an effective indicator of filling performance when filling the microvia with high aspect ratio. By adjusting the plating paremenrs, void- free filling of microvia with diameter and depth of 100 μm could be achieved.

关 键 词：旋转圆盘电极 微盲孔填充 添加剂 电镀参数 酸性镀铜 

分 类 号：TQ153.14[化学工程—电化学工业]