几种电子陶瓷材料的研究进展与应用前景  

Research Progresses and Application Prospects of Several Electronic Ceramic Materials

作　　者：张效华[1] 辛凤[1] 胡跃辉[1] 杨丰[1] 陈义川[1] 

机构地区：[1]景德镇陶瓷学院,江西景德镇333000

出　　处：《陶瓷学报》2013年第2期219-223,共5页Journal of Ceramics

基　　金：江西省自然科学基金项目(编号:20122BA212001);江西省重点科技计划指导性项目(编号:20112BBH80009);江西省高等学校科技落地计划(编号:KJLD12085);江西省教育厅科技项目(编号:GJJ13625)

摘　　要：电子科学,信息技术发展日新月异,高速奔向集成化和微型化。在电子产品中,元器件是其重要的组件之一。所以对核心元件提出更高的标准:必须具有高速,微型,轻薄,高可靠性等特点。电子元器件的核心技术就是如何利用功能陶瓷材料的电、磁、声、光、力、热等特性。元器件的发展趋势是小型化、片式化、多层化、模块化、集成化和多功能化,以及高性能低花费,方便使用。本文综合介绍了微波介电,铁电压电,磁性以及热释电等新型功能陶瓷材料,同时也介绍了最新的研究进展及可能的应用前景。The rapid integration and miniaturization of electronics demands that electronic products be high-speed, micro-thin and highly reliable. The core materials of the electronic components are functional ceramics with specific electric, magnetic, acoustic, optical, thermal and mechanical characteristics. The development trends of functional ceramic components are multi-layer, chip-based, integrated, modular and multi-functional, high-performance and low-cost. In the paper, the microwave dielectric, ferroelectric, piezoelectric, ferromagnetic, pyroelectdc and pressure-sensiUve ceramics are introduced. At the same time, the latest research progress and the possible application prospect are also introduced.

关 键 词：功能陶瓷 微波介电 铁电压电 磁电 热释电 

分 类 号：TQ174.75[化学工程—陶瓷工业]