工艺参数对过渡液相扩散连接TiAl基合金界面组织及接头强度的影响  

Effects of bonding parameters on interface structure and bonding strength of transient liquid phase diffusion bonding joint of TiAl-based alloy

作　　者：李海新[1,2] 林铁松[1] 何鹏[1] 李亮[1] 冯吉才[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001 [2]山东省科学院海洋仪器仪表研究所,山东青岛266001

出　　处：《中国科技论文》2013年第8期801-803,832,共4页China Sciencepaper

基　　金：国家自然科学基金资助项目(50975062;51105107;51021002;51275135);黑龙江省自然科学基金资助项目(QC2011C044);中央高校基本科研业务费专项资金资助项目(HIT.BRET1.2010006;HIT.NSRIF.2010119;HIT.NSRIF.201135);高等学校博士学科点专项科研基金资助项目(20112302130005)

摘　　要：采用Ti/Cu复合箔中间层过渡液相连接TiAl基合金,研究了连接工艺参数对接头界面组织、等温凝固过程及接头强度的影响。结果表明,当连接温度1 050℃时,保温时间30min或60min,接头界面呈层状结构,且有较多Ti2Cu相生成,等温凝固没有完成。延长保温时间至120min或240min时,层状结构消失,Ti2Cu相完全转化为AlCuTi相,等温凝固完成。当连接温度1 150℃时,保温时间5min即可完成等温凝固,继续延长保温时间界面组织更加均匀。当连接工艺参数为1 150℃/15min时,获得接头的室温及800℃高温抗剪强度最高,分别为269MPa和220MPa。接头主要断裂于连接接头的中间区域。TiAl-based alloy was joined using transient liquid phase （TLP） bonding technique with Ti insert foil combined with Cu foil. The effects of bonding parameters on interface structure, process of isothermal solidification and bonding strength of joints were investigated. The results showed that the interface structure presented layered-structure and large amount of Ti2 Cu phase was formed in the joints, indicating that the isothermal solidification was incomplete, when the joints were bonded at 1 050 ~C for 30 or 60 min. With the holding time increasing to 120 or 240 rain, the layer structure disappeared and Ti2Cu phase completely transformed into AICuTi phase, suggesting that the isothermal solidification was complete. When the bonding temperature was 1 150 ~C, the isothermal solidification was completed in less than 5 min. As the holding time increased, the microstructure of joints became further uniform. When the bonding parameters were 1 150℃/15 rain, the room temperature shear strength and high temperature （800℃） shear strength reached a maximum of 269 and 220 MPa, respectively. The fracture mainly occurred in the middle of the joint.

关 键 词：过渡液相扩散连接 钛铝基合金 界面结构 抗剪强度 

分 类 号：TG454[金属学及工艺—焊接]