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作 者:杨辉辉[1] 刘廷光[1] 夏爽[1] 李慧[1] 周邦新[1] 白琴[1]
出 处:《上海金属》2013年第5期9-13,62,共6页Shanghai Metals
基 金:国家重点基础研究发展计划项目2011CB610502;上海重点学科建设项目S30107资助
摘 要:利用电子背散射衍射(EBSD)和取向成像(OIM)技术研究了形变量及退火时间对H68黄铜晶界网络的影响。结果显示,形变量对处理后样品的晶界特征分布及晶粒尺寸和晶粒团簇尺寸都有显著影响,而退火时间(10 min^3 h)所产生的影响不明显;其中经5%冷轧及在550℃下退火不同时间都能够显著提高H68黄铜的低∑CSL晶界比例到80%以上,晶界网络中形成了大尺寸的互有∑3~n(n=1,2,3……)取向关系晶粒的团簇。The electron backscatter diffraction (EBSD) and orientation imaging microscopy (OIM) technique was used to analyze the effects of deformation amount and annealing time on the grain boundary network in H68 brass. The result shown that the deformation amount had an important effect on the grain boundary character distribution, the grain sizes and the grain-cluster after annealing, but the annealing time in the range of 10 min and 3 h had little effect. 5% cold rolling reduction and annealing at 550℃ for 10 rain - 3 h was a good grain boundary engineering ( GBE ) procedure. The low-∑ CSL grain boundary proportion increased to more than 80% , and large grain- clusters ware formed in the samples. Any two grains in grain-cluster had ∑3n mutual mis-orientation regardless of whether they were adjacent or not.
关 键 词:H68黄铜 晶界工程 晶粒团簇 晶界网络 低∑CSL晶界比例
分 类 号:TG146.21[一般工业技术—材料科学与工程]
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