Cl^-对镀铜层织构的影响  

Effects of Cl^- on Texture of Copper Coating

作　　者：瞿澄[1] 朱承飞[1] 袁菊[2] 姚力军[2] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009 [2]南京工业大学高技术研究院,江苏南京210009

出　　处：《电镀与环保》2013年第5期13-15,共3页Electroplating & Pollution Control

摘　　要：Cl-是镀铜工艺中必不可少的一种添加剂,它对镀层的光亮度和机械强度等都有很大的影响。采用酸性硫酸盐体系电沉积制备镀铜层,用XRD分析了Cl-对镀铜层织构的影响。结果表明:Cl-对镀层(111)晶面的织构系数没有影响;随着Cl-的质量浓度的增加,(220)晶面的织构系数出现先增后降的趋势。在铜酸比1∶1,电流密度4A/dm2,Cl-80mg/L,电解温度40℃,电解时间50min的条件下,可以获得高择优取向的镀铜层。C1- is an essential additive in copper plating process, which has a great influence on both the surface brightness and mechanical strength of the coating. The copper coating was electrodeposited by acidic electroplating copper system and the effects of C1- on the texture of the copper coating was analysised by XRD. The results show that existence of CI- have no effect on the texture coefficient of （111） crystal face; along with the increase of CI- mass concentration, （220） crystal texture coefficient tends to increase first and then decrease. Under the conditions that copper and acid proportion is 1 ： 1, current density 4 A/din2, CI- concentration 80 mg/L, electrolytic temperature 40 ℃, electrolysis time 50 minutes, a high preferred orientation copper coating can be obtained.

关 键 词：Cl- 电沉积 织构 X射线衍射 

分 类 号：TQ153[化学工程—电化学工业]