AZ 31 镁合金化学镀不同活化工艺的研究  

An Investigation on Different Activation Processes for Electroless Plating on AZ 31 Magnesium Alloy

作　　者：王娟[1] 丁毅[1] 尹明勇[1] 马立群[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与环保》2013年第5期37-40,共4页Electroplating & Pollution Control

摘　　要：采用4种不同的活化工艺对AZ 31镁合金进行活化处理,然后进行化学镀。采用扫描电镜、能谱仪、极化曲线、全浸蚀实验、开路电位等手段优选出最佳的活化方法。结果表明:植酸活化处理后形成的植酸膜对基体覆盖完全,具有较好的耐蚀性;植酸膜有利于Ni-P镀层的沉积,形成的镀层具有良好的耐蚀性,且无明显孔洞。AZ 31 magnesium alloy was activated by four different activation processes and then plated with electroless plating method. The best process was preferentially selected by means of SEM, EDS, polarization curve, erosion test, open circuit potential, etc. The results show that the substrate is covered by phytic acid film completely with a better corrosion resistance after phytic acid activation treatment. Phytic acid film is also helpful for deposition of Ni-P coating, which has a good corrosion resistance and no obvious holes.

关 键 词：活化处理 化学镀 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]