电子产品元器件去金工艺研究  

Reaserch for Component De-golding of Electronic Product

作　　者：张伟[1] 石宝松[1] 孙慧[1] 张雪莉[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《电子工艺技术》2013年第5期273-275,共3页Electronics Process Technology

基　　金：吉林省科技发展计划项目(项目编号:20120331)

摘　　要：针对电装行业的相关工艺规范要求,为避免"金脆"现象的发生,元器件引线的镀金层在焊接前应予以去除。简要分析了金脆现象产生的机理,探讨了高可靠性应用场合去金的必要性,并结合工作实际介绍了几种实用的去金工艺方法。The gold-plated layer of the component leads should be removed before soldering in order to avoid the occurrence of the phenomenon of golden crisp according to the process specification requirements of the electronics assembly industry. Analyze the mechanism of the gold brittle phenomenon, explore the necessity of degoldino for the aerospace, military and high-reliability products, and describe several tinned method of deoolding combined with the practical work.

关 键 词：搪锡技术 镀金层 去金 

分 类 号：TN6[电子电信—电路与系统]