基于加速寿命试验的IGBT模块寿命预测和失效分析  

Lifetime prediction and failure analysis of IGBT module based on accelerated lifetime test

作　　者：刘宾礼[1] 刘德志[1] 唐勇[1] 陈明[1] 

机构地区：[1]海军工程大学舰船综合电力技术国防科技重点实验室,湖北武汉430033

出　　处：《江苏大学学报（自然科学版）》2013年第5期556-563,共8页Journal of Jiangsu University：Natural Science Edition

基　　金：国家自然科学基金资助项目(50737004;51277178)

摘　　要：针对IGBT可靠性分析与寿命预测问题,提出了一种利用加速寿命试验对IGBT模块使用寿命进行预测的新方法.论述了加速寿命试验的原理与方法,提出采用对数正态分布描述IGBT模块的寿命分布,以阿伦尼斯模型为基础,利用极大似然估计法对试验数据进行统计与分析,建立了IGBT模块的寿命预测模型,实现了对正常应力下模块寿命的科学估计,并对IGBT模块的失效机理进行了详细分析.结果表明,IGBT模块寿命服从对数正态分布,纠正了以往认为其服从Weibull分布的错误思想.随结温差和平均结温的增大,IGBT模块寿命逐渐减小,并且当模块到达寿命终点时,其最终失效形式为热失效.To realize reliability analysis and lifetime prediction of IGBT, a new method for the lifetime prediction of IGBT module was proposed based on accelerated lifetime test. The theory and the method of fast power cycling test were dissertated. The lognormal distribution was adopted to describe the lifetime of IGBT. Based on Arrhenius module, the statistic and the analysis on testing data were achieved by maxi- mum likelihood estimation method to establish lifetime prediction model of IGBT . The accurate estima- tion of IGBT lifetime was realized, and the failure mechanism of IGBT was analyzed in detail. The resuhs show that the IGBT lifetime is followed by lognormal distribution, not by Weibull distribution. With the increasing of junction temperature range, the lifetime of IGBT is decreased, and the mode is thermal fai- lure at the end of IGBT lifetime.

关 键 词：加速寿命试验 统计分析 寿命分布 预测模型 失效机理 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置] TM351[自动化与计算机技术—控制科学与工程]