挠性覆铜板用高性能覆盖膜的开发及性能研究  

Development and study on properties of a high performance coverlay for FCCL

作　　者：周韶鸿[1] 刘生鹏[1] 茹敬宏[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2013年第10期12-14,23,共4页Printed Circuit Information

摘　　要：通过一种改性聚酰亚胺与环氧树脂的组合,开发出一种新型的胶黏剂,以其制备新型无卤覆盖膜,并命名为SF202C。该覆盖膜与传统的环氧树脂/丁腈橡胶体系的无卤覆盖膜进的对比测试,结果表明,SF202C不仅满足IPC标准,还具较长的室温储存期,且优异的热老化性、耐变色性及耐离子迁移性。By compounding modified polyimide and epoxy, a novel adhesive was developed and used to prepare a new-type halogen-free coverlay named SF202C. Compared with common epoxy/NBR system halogen- free coverlay, the test results show that SF202C can not only meet the IPC standard, but also possesses longer shelf life, excellent thermal aging resistance, discoloration resistance and anti-ion migration.

关 键 词：覆盖膜 改性聚酰亚胺 高性能 储存期 耐离子迁移 

分 类 号：TN41[电子电信—微电子学与固体电子学]