无胶单面挠性覆铜板与不流动粘结片结合力的考察  

The study on the binding force between 2-layer single-side FCCL and no-flow prepreg

作　　者：梁立[1] 伍宏奎[1] 罗浩[1] 茹敬宏[1] 

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523039

出　　处：《印制电路信息》2013年第10期20-23,共4页Printed Circuit Information

摘　　要：文章对刚挠结合印制板用无胶单面挠性覆铜板与不流动粘结片的结合力进行了考察,结果表明增加PI表面粗糙度和减小PI表面接触角可以提高结合力,但一般不大于0.6N/mm;对PI表面进行等离子处理可以将结合力提高到客户要求的大于0.8N/mm;而提高无胶单面挠性覆铜板与不流动粘结片结合力的最有效的方法是使用高锰酸钾溶液对PI进行表面处理,在合适的条件下,结合力可达到1.15N/mm。The binding force between 2-layer single-side FCCL and no-flow prepreg for rigid-flex PCB is studied in this paper. We found that increasing the surface roughness of PI and decreasing the contact angle of PI can increase the binding force between 2-layer single-side FCCL and no-flow prepreg, although the binding force is less than 0.6Nhnm. The binding force is raised to greater than 0.8N/ram which client demand after plasma treatment oil P1 surface. However, tile most effective method to increase the binding force between 2-layer single-side FCCL and no-flow prepreg is Potassium permanganate solution treatment on P1 surface. The binding lbrce can reach I. 15N/ mm tinder the right conditions.

关 键 词：无胶单面挠性覆铜板 不流动粘结片 结合力 

分 类 号：TN41[电子电信—微电子学与固体电子学]