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机构地区:[1]上海康达化工新材料股份有限公司,上海201201 [2]上海胶粘剂工程技术研究中心,上海201419
出 处:《中国胶粘剂》2013年第9期11-13,共3页China Adhesives
基 金:上海市科学技术委员会资助项目(11DZ2283500)
摘 要:以环氧树脂(EP)胶粘剂作为试验对象,采用DSC(差示扫描量热)法测定EP胶粘剂样品的T_g(玻璃化转变温度),并探讨了EP胶粘剂样品固化过程中的升温速率、固化时间、固化温度及固化热机械史等对其T_g的影响。结果表明:为使EP胶粘剂样品固化更完全,应尽可能选择低升温速率固化样品;通过优化材料的固化条件,可使材料的耐热性能更优良;样品长时间受热后会降低其T_g,并且受力样品的T_g高于未受力样品的T_g。With EP(epoxy resin) adhesive as experimental object,the Tg(glass transilion tenll)eralure) of EP adhesive sample was tested hv DSC(differential scanning calorimetry),and the influences of some factors(such as healing speeds in curing profess,curing times,curing temperatures anti thermal mechanical hislory of EP adhesive samples) on Tg were discussed. The resuhs showed that in order to could more eomplelely cure EP adhesive samples,the samples should be cured by low heating speed. The material had better heal-resistance by optimizing curing conditions. The sample,which was heated by a long time,will reduee its Tg,and the Tg of loaded sample was higher than thai of unloaded sample.
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