电真空器件玻璃封接工艺研究  

Study on glass sealing technics of electronic vacuum devices

作　　者：马迎英[1] 欧丽[1] 梁力[1] 张强[1] 陶青[1] 万瑞芸[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《现代电子技术》2013年第20期148-152,共5页Modern Electronics Technique

基　　金：国家自然科学基金(11205136)

摘　　要：总结了电真空器件玻璃封接实践中所遇到的气密性、强度及稳定性的一系列问题,包括玻璃与可伐封接的气泡、封接颜色异常、贴边尺寸超差现象和玻璃与玻璃封接的失透、雾化等现象。通过工作中的工艺实践结合相关资料,运用多种现代科技手段对其形成原因进行了一定探究。对提高玻璃封接质量和可靠性进行了有益的尝试,形成了此类玻璃封接问题具体的操作工艺解决方法。通过实施这些方法,提高了玻璃封接件的可靠性,保障了科研生产工作的顺利进行。The problems such as gas-tightness,strength and stability,which would appear in glass sealing practical opera-tion of electronic vacuum devices,including bubble,abnormal sealing color,overproof welt size in glass-Kovar sealing,and de-vitrification and pulverization phenomena in glass-glass sealing,were summarized in this paper. The reasons of these phenomena were researched by means of various modern technology means,technologies and theory. Some experiments to improve the quali-ty and feasibility of glass sealing products were carried out. Thus,scientific research and production could go on wheels by these measures.

关 键 词：玻璃封接 电真空器件 质量分析 可靠性提高 

分 类 号：TN710-34[电子电信—电路与系统]