粉末注射成形制备氮化铝陶瓷  

Powder Injection Molding Aluminium Nitride Ceramic

作　　者：鲁慧峰[1] 秦明礼[1] 储爱民[2] 刘昶[1] 曲选辉[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]湖南科技大学机电工程学院,湖南湘潭411201

出　　处：《真空电子技术》2013年第4期69-72,共4页Vacuum Electronics

摘　　要：以氮化铝粉末为原料,添加5%Y2O3,通过注射成形工艺,制备出全致密、热导率为182 W/m·K的氮化铝陶瓷。研究了氮化铝陶瓷烧结过程中致密过程及组织变化,合理制订了复杂形状氮化铝陶瓷的烧结工艺,制备出了高尺寸精度,高热导率的氮化铝电子封装零件。Aluminium nitride ceramics were fabricated from aluminium nitride powders add 5 ％Y2O3 by powder injection molding,the sintering body was full density and thermal conductivity was 182 W/m · K.Procedures of body densification and structure change during sintering process were studied.High dimensional accuracy and thermal conductivity AlN electronics packaging parts with complex shape were fabricated by optimized the sintering process.

关 键 词：粉末注射成形 氮化铝 烧结 热导率 

分 类 号：TF124[冶金工程—粉末冶金]