非等温差示扫描量热法研究杂萘联苯聚芳醚酮改性环氧树脂体系的固化动力学  

Curing Kinetics of Epoxy Resin/Poly(Phthalazinone Ether Ketone) Characterized by Nonisothermal DSC

作　　者：徐亚娟[1] 周思凯[1] 廖功雄[2] 蹇锡高[2] 

机构地区：[1]洛阳理工学院材料科学与工程系,河南洛阳471023 [2]大连理工大学高分子材料系,辽宁大连116012

出　　处：《高分子材料科学与工程》2013年第10期98-100,共3页Polymer Materials Science & Engineering

摘　　要：采用非等温差示扫描量热仪(DSC)对环氧树脂(E-51)/杂萘联苯聚芳醚酮(PPEK)共混物的固化过程进行研究。利用T-β外推法确定了固化工艺温度,并利用Kissinger和Crane法计算得到共混体系固化反应的表观活化能Ea、指前因子A、固化反应级数n等动力学参数。结果表明,PPEK的加入对环氧树脂的固化反应温度影响不大,但反应活化能有所升高,表明PPEK的加入阻碍了固化反应的进行。通过固化度与固化时间的关系曲线证明,PPEK的加入不改变环氧树脂的固化反应机理。The curing reactions of epoxy resinS（E-51 ） modified with poly （phthalazinone ether ketone） （ PPEK ） were studied by non-isothermal differential scanning calorimetry （DSC）. Curing temperature was calculated by T-/9 extrapolation. The curing kinetics parameters of systems, including the apparent activation energy, reaction orders and the pre-exponential factor of the curing reaction were calculated by Kissinger and Crane method. The results show that addition of PPEK has little effect on the curing process temperature of E-51, but the apparent activation energy increases, which proves that the process of the curing reaction is hindered by the addition of PPEK. The plots of conversation versus time suggest that PPEK does not change the curing reaction kinetics of E-51.

关 键 词：杂萘联苯聚醚酮 环氧树脂 固化动力学 差示扫描量热仪 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]