半导体制冷与固体除湿结合装置的性能探究  

Performance Research of a Semiconductor Cooling Device with Solid Desiccant

作　　者：郑宇薇[1] 刘晓华[1] 涂壤[1] 

机构地区：[1]清华大学建筑技术科学系,北京100084

出　　处：《制冷学报》2013年第5期59-64,共6页Journal of Refrigeration

基　　金：教育部高等学校博士学科点专项科研基金(20090002120022)资助项目~~

摘　　要：半导体制冷(又称热电制冷)因为降温迅速、易于控制等优点,广泛应用在工业生产、日常生活等方面。而热端散热效果成为制约半导体制冷效率的主要因素。半导体制冷在空气除湿领域的应用研究日趋深入,但传统的冷却除湿要求半导体冷端温度较低,使半导体制冷效率降低。建立半导体制冷(热管排热系统)、固体吸附剂结合的除湿模型,通过6级半导体制冷与热管散热系统的实验装置对干工况进行模拟验证,再模拟固体除湿工况在不同输入电流下的性能。模拟结果表明:当除湿量与文献中半导体冷却除湿装置相同时,该半导体与固体除湿结合的模型的系统COP为1.78,明显高于文献中装置的COP。说明结合固体吸附剂后可以加强传质动力提高冷端温度,从而提高系统性能。Semiconductor refrigeration, known as thermoelectric refrigeration, is applied widely in fields such as industrial production and daily life, due to the advantages of rapid cooling and easy control. The heat dissipation on the hot side is the principle element restricting the coefficient of semiconductor refrigeration. In conventional device, dehumidification is realized by condensing dehumidification method, which lowers the temperature of the cold side of semiconductor and hence restricts the system COP. The semiconductor refrigeration model with heat pipe and solid desiccant is built in this paper, and verified by the experimental results of a 6-stage semiconductor refrigeration equipment with heat pipes. Then the model is used to predict the cooling and dehumidification performances with solid desiccant. The COP of the proposed semiconductor refrigeration system is 1.78, which is much higher than that shown in literature with condensing dehumidifi- cation under the same dehumidification amount.

关 键 词：空调制冷 半导体 固体除湿 热管排热 除湿性能 

分 类 号：TU834.9[建筑科学—供热、供燃气、通风及空调工程] TU831.4