基于Abaqus的叠层器件有限元分析  

Finite element analysis on laminated device based on Abaqus

作　　者：刘长虹[1] 朱星宇[1] 余沁智[1] 张恒[1] 

机构地区：[1]华东理工大学承压系统与安全教育部重点实验室,上海200237

出　　处：《计算机辅助工程》2013年第A02期321-323,共3页Computer Aided Engineering

基　　金：上海市重点学科建设项目(B503)

摘　　要：针对叠层结构的热应力和散热问题,用Abaqus建立叠层结构热应力和流体动力学分析模型.热应力分析结果表明在芯片与板两种材料结合部位的应力较大;流体动力学分析结果表明在叠层间空气的流动比外表面小.As to the heat stress and heat issues of laminated structure, the thermal stress and fluid dynamics models of laminated structure are built using Abaqus software. The thermal stress analysis results show that the stress at the two material combination between the chip and the board binding site is large. The fluid dynamics analysis results show that the flow of air between the laminates is smaller than that of the outer surface.

关 键 词：叠层结构 热应力 流体动力学 有限元 ABAQUS 

分 类 号：TN401[电子电信—微电子学与固体电子学]