Z-pins增强C/SiC复合材料层间I型断裂韧性  

MODE I INTERLAMINAR FRACTURE TOUGHNESS FOR Z-PINS REINFORCED C/SiC COMPOSITES

作　　者：刘韡[1] 矫桂琼[2] 

机构地区：[1]西安建筑科技大学理学院,西安710055 [2]西北工业大学力学与土木建筑学院,西安710072

出　　处：《固体力学学报》2013年第5期466-472,共7页Chinese Journal of Solid Mechanics

基　　金：高等学校博士学科点专项科研基金项目(20030699040);陕西省教育厅专项科研基金项目(2010JK628)资助

摘　　要：提出手工预缝纫方法将3K丝束的T300碳纤维引入预成型体,经过多次反复化学气相渗透工艺,在预成型体和缝线处同时渗透SiC基体,制备Z-pins增强平纹编织C/SiC陶瓷基复合材料.通过双悬臂梁对称弯曲试验测定了层间Ⅰ型应变能释放率,分析了材料的裂纹扩展行为和Z-pins增强机理,建立了层间Ⅰ型裂纹扩展预测模型.结果表明:Z-pins植入平纹编织C/SiC陶瓷基复合材料层压板能提高层间I型断裂韧性.Z-pins增强平纹编织C/SiC陶瓷基复合材料层压板Ⅰ型层间增强机理主要是Z-pins桥连和Z-pins拔出.层间裂纹扩展预测模型的预测结果与试验结果吻合较好.A manual pre-stitching method was developed to introduce 3K T300 carbon fiber bundle into a preform.Z-pins reinforced woven C/SiC ceramic matrix composite （CMC） was manufactured by using chemical vapor infiltration （CVI） to infiltrate SiC matrix into woven preform and carbon fiber sutures simutaneously and repeatedly.Then,the mode Ⅰ strain energy release rates of the delamination of Z-pins reinforced woven C/SiC ceramic matrix composites were tested by double cantilever beam （DCB） specimen.The delamination behaviors and reinforced mechanisms of the newly manufactured CMC were analyzed and a new prediction model of delamination growth was developed.Results showed that （1） interlaminar fracture toughness of mode Ⅰ is improved by Z-pins insertion into woven C/SiC ceramic matrix composites; （2）Z-pins bridging interlaminar crack and Z-pins pull-out are the major reinforcement mechanisms of Z-pins reinforced woven C/SiC ceramic matrix composites; （3） the predicted results by the delamination growth model are in good agreement with the experiments.

关 键 词：陶瓷基复合材料 断裂韧性 应变能释放率 增强机理 Z-PINS 

分 类 号：TB332[一般工业技术—材料科学与工程]