基于光学读出非制冷红外成像系统的无基底FPA等效电学模型  

Equivalent circuit model of the substrate-free focal plane array based on the optical readout uncooled infrared imaging system

作　　者：张勇[1] 程腾[1] 张青川[1] 陈大鹏[2] 高杰[1] 毛亮[1] 吴健雄[1] 高越[1] 

机构地区：[1]中国科学技术大学中国科学院材料力学行为和设计重点实验室,安徽合肥230027 [2]中国科学院微电子研究所,北京100029

出　　处：《红外与毫米波学报》2013年第5期394-399,443,共7页Journal of Infrared and Millimeter Waves

基　　金：国家自然科学基金(11072233;11102201;11127201);中央高校基本科研业务费专项资金(WK2090050017);中国博士后科学基金(20100480684);江苏省自然科学基金(BK2011373)~~

摘　　要：与传统的有基底FPA(焦平面阵列)相比,基于全镂空支撑框架结构的新型无基底FPA在热学特性上存在显著差异,传统的基于恒温基底假设的热学分析模型不再适用,因此,通过电学比拟方法,将无基底FPA的热响应特性等效为电学模型.通过该模型,进一步分析了无基底FPA在非真空环境下的热学性能,分析表明:该无基底FPA具有在大气压下优良的红外成像性能,其NETD(噪声等效温度差)值仅比真空环境下增加了数倍.Thermal characteristics of new substrate-free FPA （focal plane array） with full hollow supporting frame struc- ture are very different from that of traditional substrate FPA. The thermal analysis model which based on temperature- constant substrate assumption is not efficient any more. Therefore, an equivalent circuit model was presented to analyze the thermal response characteristics of substrate-free FPA with electrics and holistic approach. According to this model, the thermal characteristics of substrate-free FPA under non-vacuum environment were analyzed. The result shows that, the substrate-free FPA has excellent infrared imaging performances under atmospheric pressure, while its NETD （noise equivalent temperature difference） is just increased several times than in the vacuum environment.

关 键 词：非制冷红外成像 等效电学模型 电学比拟 光学读出 焦平面阵列 

分 类 号：TN216[电子电信—物理电子学]