多电子元件及芯片组布局的热分析  

Thermal Analysis of the Multi Electronic Component and Chipset Placement

作　　者：崔昊杨[1] 许永鹏[1] 曾俊冬[1] 唐忠[1] 钱婷[2] 

机构地区：[1]上海电力学院电子与信息工程学院,上海200090 [2]上海电子信息职业技术学院通信与信息工程系,上海210411

出　　处：《上海电力学院学报》2013年第5期459-462,共4页Journal of Shanghai University of Electric Power

基　　金：国家自然科学基金(61107081);上海市教育委员会科研创新项目(10YZ158;12ZZ176)

摘　　要：针对电子线路板上多电子元件及芯片组的不同布局所产生的热场分布问题,分析了分布元件的热产生、热传导、对流和辐射过程,采用有限元理论分析方法和ANSYS软件,对线路板上多芯片组件的热场分布进行仿真.结果表明:电子元件的不同布局将导致线路板热点的温度存在差别,在有限空间内合理布置元件可明显降低设备的热失效率.In order to solve the problem of the thermal field distribution of electronic circuit board generated by the different multi-electronic components and chipset layout,the finite element theory and ANSYS software are used to simulate the thermal field distribution by considering the heat generation, heat conduction, convection and radiation processes. The results show that the different layout of the electronic components will result in the difference of the hottest temperature of the circuit board. Therefore, the heat loss efficiency of the device can be reduced significantly by arranging the components reasonably.

关 键 词：芯片组布局 热场分布 有限元理论 

分 类 号：TN602[电子电信—电路与系统]