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作 者:袁利辉[1] 王汝敏[1] 胡睿[1] 王道翠[1]
机构地区:[1]西北工业大学理学院应用化学系,西安710072
出 处:《工程塑料应用》2013年第11期4-8,共5页Engineering Plastics Application
摘 要:先将线性酚醛树脂(PF)烯丙基醚化,再用双马来酰亚胺(BMI)改性烯丙基醚化的线性PF(AEN),得到AEN/BMI共聚物(BAN),通过傅立叶变换红外光谱、凝胶化时间和差示扫描量热分析分别分析了BAN的结构和固化工艺,测试了不同烯丙基醚化程度的BAN模塑料的耐热性、电性能和力学性能。结果表明,当固化剂为六次甲基四胺时,模压温度为160℃、后处理工艺为140℃/1 h+150℃/1 h+160℃/2 h、烯丙基醚化程度为36.5%时,BAN模塑料的综合性能最佳。The linear phenolic resin was etherified by allyl firstly, then the linear phenolic resin with allyl etherification was modified by bismaleimide(BMl), the structure and the curing process of modifed phenolic resin were analyzed by FTIR, Gelation time and DSC, the heat resistance, electric properties and mechanical properties test of the modified phenolic molding compounds with different degree of allyl etherification were done. The research results show that when the mold temperature is 160℃, the post processing technology as follows:140℃ / 1 h +150 ℃ / 1 h + 160℃ /2 h, HTMA for curing agent and the degree of allyl etherification is 36.5%, the molding compounds with modified phenolic resin as matrix have the best comprehensive performances.
分 类 号:TQ323.1[化学工程—合成树脂塑料工业]
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