金属间化学反应在镀锡层中导致的应力场  

Stress Field Due to Formation of Intermetallice Compound in the Tin Plate

作　　者：强磊[1] 黄再兴[1] 

机构地区：[1]南京航空航天大学机械结构力学及控制国家重点实验室,南京210016

出　　处：《力学季刊》2013年第3期384-392,共9页Chinese Quarterly of Mechanics

基　　金：航空科学基金(20080252)

摘　　要：镀锡层中锡铜金属间化合物颗粒的生成可以导致内应力的产生,将这种现象视为夹杂的膨胀,采用镜像法求得在有限厚度弹性板内的伽辽金矢量,进而得到弹性板内因夹杂膨胀所产生的应力场,并与有限元软件Abaqus的计算结果进行对比,符合的极好。根据弹性板内应力场的分布,对锡晶须的生成条件及其影响因素进行了预测与分析。结果表明锡晶须生成于自由表面上距离夹杂最近的几何位置。The formation of the intermetallic compound grain Cu6 Sn5 gave rise to the internal stress in the tin-plating layer. This phenomenon could be characterized with the expansion of inclusion in a plate. In this paper, the image method was used to find the Galerkin vectors of the elastic field due to the inclusion expanding in the plate. The components of displacement and stress were determined in terms of the par- tial derivatives of the Galerkin vectors. And the results were in accordance with that given by FEM soft- ware Abaqus. The critical condition of the Sn whisker nucleation was given according to the distribution of the Mises stress. And the relevant factors affecting the Sn whisker nucleation were discussed. The results showed that the Sn whisker occurred at the point, closest to the inclusion, on the free surface.

关 键 词：金属间化合物 本征应变 锡晶须 夹杂 伽辽金矢量 

分 类 号：O343.2[理学—固体力学]