面向软基带SOC芯片设计的仿真平台  

Simulation Platform for Soft Baseband SOC Processor Design

作　　者：刘智国[1,2,3] 朱子元[1,2,3] 唐杉[1,2,3] 苏泳涛[1,2,3] 王宏伟[1,2,3] 石晶林[1,2,3] 

机构地区：[1]中国科学院计算技术研究所,北京100080 [2]中国科学院大学,北京100080 [3]移动计算与新型终端北京市重点实验室,北京100080

出　　处：《系统仿真学报》2013年第11期2575-2581,2589,共8页Journal of System Simulation

基　　金：2012重大专项TD-LTE-Advanced终端基带芯片工程样片研发(2012ZX03001016003);北京市科技计划LTE终端基带芯片研发;北京市教育委员会共建项目专项资助

摘　　要：设计实现了面向软基带SOC芯片设计的仿真平台,支持快速搭建仿真系统,进行芯片架构设计及性能评估,支持软基带SOC设计的专用指令集处理器(ASIP)建模,支持软硬件界面划分及算法仿真优化。通过本平台的仿真,能够在设计初期对芯片体系结构和需要实现的功能算法进行快速模拟及评估,确定满足应用需求的最优的体系结构和片上资源的配置。并以LTE软基带芯片设计建模过程为例,说明了该仿真平台的有效性。A simulation platform was designed and implemented, aiming to provide a hand-on modeling and evaluation tool to assist the design of soft baseband SOC processor. Using this platform, a system could be setup rapidly to design the system architecture and evaluate its performances. The platform also supported the modeling of ASIP, which was needed in soft baseband SOC design, the software/hardware partition, and the optimization of algorithms. Through the simulation platform, a fast modeling and evaluation could be realized on the structure and functions of the soft baseband processor, so that the most appropriate scheme could be chosen. Finally, a long time evolution （LTE） soft baseband SOC design and simulation was taken as an example to illustrate the advantages of using this platform.

关 键 词：软基带 仿真 LTE DSP VLIW SYSTEMC SOC 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]