高密度脉冲电流对Cu单晶体驻留滑移带的影响  

THE EFFECT OF HIGH CURRENT DENSITY ELECTROPULSING ON PERSISTENT SLIP BANDS (PSBs) IN FATIGUED COPPER SINGLE CRYSTALS

作　　者：肖素红[1] 周亦胄[1] 吴世丁[2] 姚戈[2] 李守新[2] 周本濂[1,3] 周本濂 

机构地区：[1]中国科学院金属研究所 [2]中国科学院金属研究所材料疲劳与断裂国家重点实验室 [3]中国科学院国际材料物理中心沈阳110015

出　　处：《金属学报》2000年第12期1237-1239,共3页Acta Metallurgica Sinica

基　　金：国家自然科学基金资助项目! 59931020

摘　　要：对含驻留滑移带（ＰＳＢ）的 ［１２３］取向的疲劳 Ｃｕ单晶体，进行了高密度脉冲电流处理结果表明，高密度脉冲电流处理产生的热压应力改善了ＰＳＢ－基体界面的应力集中状态，使驻留滑移带局部消失理论计算同时表明，高密度脉冲电流处理能提高 Ｃｕ单晶疲劳寿命．Fatigued copper single crystals with [123] loading axis were treated by high current density electropulsing after the formation of persistent slip bands (PSBs). The results show that thermal compressive stress caused by electropulsing improved the stress concentration at the interface between PSB and matrix, and the PSBs disappeared locally. Theoretical calculation shows that the treatment by high current density electropulsing could raise the fatigue life of copper single crystals.

关 键 词：驻留滑移带 脉冲电流 热压应力 铜单晶体 

分 类 号：TG146.11[一般工业技术—材料科学与工程]