一种精确的同轴封装DFB激光器组件的热学模型  

Precise Thermal Simulation Module for DFB Laser Sub-Assembly with Transistor Outline Package

作　　者：侯小珂[1,2] 张丽卿 张胜利 王雷 姚勇[1] 

机构地区：[1]哈尔滨工业大学深圳研究生院,广东深圳518055 [2]深圳新飞通光电子技术有限公司,广东深圳518037

出　　处：《中国激光》2013年第10期28-32,共5页Chinese Journal of Lasers

基　　金：广东省和教育部产学合作项目(2010B090400306);深圳市基础研究计划(JC201105160592A)

摘　　要：基于有限元方法(FEM)建立了精确的同轴封装无致冷分布反馈布拉格(DFB)激光器发射组件(TOSA)的热分析模型。对TOSA的热场分布和结温进行模拟和分析,并通过实验验证热学模型的正确性。利用极窄脉冲法测量TOSA的峰值波长随壳温的变化,拟合了壳温与波长的定量关系式。通过实测得到激光器的结温、晶体管形(TO)封装管壳的壳温与热功耗的关系曲线,并同时对不同热功耗下的激光器结温和TO封装管壳的壳温进行模拟,FEM模拟的结果与实测结果十分吻合。根据实测的温度梯度求得激光器组件在不同环境温度下的热阻。所建立的热学模型具有较高的精确性,可以用于TOSA及光收发模块的散热设计。A precise thermal simulation model for distributed feedback Bragg （DFB） laser transmitter optical swb- assembly （TOSA） with uncooled transistor outline package is established based on the finite element method （FEM）. The thermal gradient and iunetion temperature are simulated and analyzed. The self-consistency of this model is verified by comparing with experiments. The change of lasing peak wavelength as a function of case temperature is measured by pulse injection and the relationship is calculated. The relationships between laser junction temperature, case temperature of transistor outline （TO） case and thermal power are obtained by measurements. The laser junction temperature and TO case temperature are also simulated at different thermal powers. The simulated results are agree well with the measured results. The thermoresistance of the laser subassembly is calculated based on the measured temperature gradient at different environmental temperatures. The thermal model reported by this paper is very precise and can be used for thermal design of TOSA and transceiver.

关 键 词：激光器 半导体激光器 有限元方法 热学模型 热阻 

分 类 号：TN248[电子电信—物理电子学]