硫氰酸盐--铁(Ⅲ)体系从废电路板中选择性浸出金银  

Selective Leaching of Gold and Silver from Waste Printed Circuit Boards in Thiocyanate-Ferric System

作　　者：王治科[1] 张含[1] 叶存玲[1] 

机构地区：[1]河南师范大学环境学院,河南省环境污染控制重点实验室,黄淮水环境与污染防治省部共建教育部重点实验室,河南新乡453007

出　　处：《有色金属（冶炼部分）》2013年第11期32-35,共4页Nonferrous Metals（Extractive Metallurgy)

基　　金：河南省基础与前沿技术研究计划项目(102300410097,122300410271);河南省高等学校青年骨干教师项目(2010GGJS-067);河南省创新型科技人才队伍建设工程项目(2011)

摘　　要：采用硫氰酸盐法从硫酸双氧水体系预处理废电路板金属部分后的渣中选择性浸出金银,并对硫氰酸盐浓度、铁离子浓度、溶液pH、液固比、搅拌速度、温度、浸出时间等因素进行优化。结果表明,在0.1mol/L Fe3+、0.6mol/L SCN-、pH=2、液固比500∶2、搅拌速度200r/min、温度15℃、浸出8h的条件下,金银浸出率分别达到95%和99%,铅浸出率不超过4.5%。Gold and silver were selectively leached HzSO4-H2O2 system to pretreat metallic fractions of waste centrations of thiocyanate and ferric, pH value, ratio of and leaching time were optimized. The results show th respectively and lead leaching rate does not exceeded 4. tration of Fea＋ of 0.1 mol/L, concentration of SCN o of 200 r/min, temperature of 15 and leaching time thiocyanate process from residue obtained by printed circuit boards. The parameters of con- liquid to solid （L/S）, stirring speed, temperature at gold and silver 5% under the opt extraction rate are 95G and 99% imum conditions including concen- of 2, L/S=500/2, stirring speed

关 键 词：硫氰酸盐 浸出 废电路板 金 银 

分 类 号：TF831[冶金工程—有色金属冶金] TF832