晶粒度对铜点蚀行为的影响  

Effect of Grain Size on Pitting Corrosion Behavior of Copper

作　　者：李珂[1] 张平[2] 刘慧娟[1] 周琼宇[1] 钟庆东[1] 

机构地区：[1]上海大学上海市现代冶金与材料制备重点试验室,上海200072 [2]四川省电力公司遂宁公司,遂宁629000

出　　处：《腐蚀与防护》2013年第11期972-976,共5页Corrosion & Protection

基　　金：国家自然科学基金(50571059;50615024);汽车用钢开发与应用技术国家重点试验室(宝钢)开放课题;教育部新世纪优秀人才支持计划资助项目(NCET-07-0536)

摘　　要：采用循环极化测试和电化学阻抗谱测试,考察分析了不同晶粒度在不同溶液中对铜点蚀行为的影响。利用光学显微镜、扫描电镜和电化学工作站对不同晶粒度的铜试样在三种溶液中的腐蚀形貌和电化学性能进行表征和测量。结果表明,在含SO42-/HCO3-的溶液体系中铜发生活性溶解型点蚀,且点蚀敏感性随晶粒度减小而增加;在含OH-的碱性环境中,晶粒度减小将促进铜快速形成具有保护性的钝化膜层;SO42-将导致铜在OH-碱性环境中发生钝化膜破裂型点蚀,其点蚀敏感性随晶粒度减小而降低。Circular polarization and electrochemical impedance spectroscopy（EIS） were used to analyze the effect of different grain sizes on the pitting corrosion behavior of fine copper. Optical microscopy, scanning electron microscopy（SEM） and electrochemical workstation were used to analyze the surface properties of copper specimens with different grainsizes in three kinds of solution. The results indicate that active dissolved pitting corrosion of Cu occurred in SO42 / HCO3- mixed solution, the pitting sensitivity of Cu increased with the reduction of grain size; hut in the alkaline solution with OH , the reduction of grain size promoted the formation of the protective passive film which owns fine self-healing capacity. S（h2 led to the film rupture of Cu in the alkaline solution with OH . The smaller the grain size, the weaker the pitting sensitivity of Cn surface.

关 键 词：晶粒度 铜 点蚀 电化学阻抗谱 

分 类 号：TG172.63[金属学及工艺—金属表面处理]