热压条件下Cu/Al复合带界面扩散反应研究  

Interfacial diffusion reaction of Cu/Al laminates under hot pressing

作　　者：张迎晖[1] 秦镜[1] 赵鸿金[1] 

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000

出　　处：《金属热处理》2013年第10期42-45,共4页Heat Treatment of Metals

基　　金：国家自然科学基金(50964006)

摘　　要：研究了经冷轧复合的Cu/Al复合带在热压温度为500℃、实际压下率为0％～35％变形条件下的铜铝界面扩散反应。结果表明，在此界面扩散反应的过程中，存在晶界扩散机制。 Cu/Al复合界面扩散反应生成相次序受相变热力学和扩散动力学两方面因素共同控制，不但与各相生成吉布斯自由能有关，而且遵守通量-能量原则。虽然增加压下率对界面扩散层的生长起到一定的促进作用，但温度仍然是其主要影响因素。The interfacial diffusion reaction of cold-rolled Cu/Al laminates was studied under the deformation condition that the temperature was 500 ℃and the reduction rate was 0%to 35%.The results show that there existed grain boundary diffusion mechanism in the process of interfacial diffusion and reaction .The formation sequence of intermediate phases on the Cu /Al interface depends on both the diffusion kinetic and thermodynamic phase transition .It was not only related to Gibbs free energy of forming each phase , but also followed the principle of flux-energy.Increasing the reduction rate played a role in promoting growth of Cu /Al interface diffusion zone , but temperature was still the most important factor which affects the Cu/Al interfacial diffusion zone growth .

关 键 词：CU Al复合带 热压 界面扩散 热力学 动力学 

分 类 号：TG166[金属学及工艺—热处理]