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出 处:《粘接》2013年第10期44-47,共4页Adhesion
摘 要:以无酸丙烯酸酯系压敏胶为导电胶基体,苯二亚甲基二异氰酸酯(XDI)为交联剂,镍/银混合粉体为导电填料,制备了铜箔导电胶带。讨论了导电粒子的种类及其添加量、交联剂的用量、老化存放时间等对导电胶带的粘接性能、导电性能及电磁屏蔽性能的影响。结果表明,当镍银混合粉添加15%,交联剂用量25%,干胶厚度45μm时,制备的胶带综合性能良好。其粘接强度大于19N/25mm,体积电阻率为6×10^-3Ω·cm,电磁屏蔽效能大于90dB(频率从30-1500MHz),且耐高温性能稳定。A copper foil electrically conductive PSA tape was prepared using the acid-free acrylate PSA as the matrix,XDI(xylylene diisocyanate) as the cross linker,and Ni/Ag mixed powder as the conductive filler.The influence of the type and content of conductive filler,the cross linker amount and the storage ageing time was discussed on the bonding performance,conducivity and electromagnetic shielding effectiveness for the conductive tape.The experiment results indicated that the corresponding PSA tape had good combination property,high bonding strength (over 19N/25 mm),excellent conductivity (volume resistivity 7×10^-3Ω·cm),electromagnetic shielding effectiveness (SE over 90 dB) and high temperature resistance when the content of Ni/Ag composite particles was 15 wt%,tbe amount of XDI was 2.5 wt% and the thickness of dry adhesive coating was 40μ m.
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