低温固化烯丙基酚氧树脂/双马来酰亚胺树脂的研究  

Low temperature curable allyl phenol epoxy resin/bismaleimide resin

作　　者：胡睿[1] 王汝敏[1] 王道翠[1] 强雪原[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710129

出　　处：《粘接》2013年第10期52-54,共3页Adhesion

摘　　要：为降低双马来酰亚胺树脂的固化温度,用2-甲基咪唑(2-MI)为烯丙基酚氧树脂/双马来酰亚胺树脂体系的固化催化剂,测试了改性树脂体系的凝胶化时间、力学性能和热性能,并探讨了催化剂含量对树脂性能的影响。结果表明,当催化剂质量分数为0.5%时,体系性能最佳。冲击强度为226.39 kJ/m,弯曲强度为144.85 MPa,热变形温度为202℃,树脂具有良好的韧性,并保持了优异的耐热性。In this paper,2-methylimidazole （2-MI） as the curing catalyst was added to the allyl phenol epoxy resin/bismaleimide resin system in order to reduce the curing temperature of modified bismaleimide resin.The gelation time,mechanical properties and thermal properties of the modified resin system were tested.It was found that when the content of the catalyst was 0.5 wt%, the impact toughness,flexible strength and heat distorsional temperature of the modified bismaleimide resin were 26.39 kJ/m2,144.85MPa and 202℃,respectively.That means the material has good toughness and heat resistance.

关 键 词：双马来酰亚胺 催化剂 烯丙基化合物 增韧 

分 类 号：TQ433.43[化学工程]