WC/Cu复合材料组织及烧结过程研究  

THE MICROSTRUCTURE AND SINTERING PROCESS OF P/M WC REINFORCED COPPER COMPOSITE

作　　者：赵乃勤[1] 周复刚[1] 陈民芳[1] 王哲仁[1] 李国俊[1] 

机构地区：[1]天津大学材料学院,天津300072

出　　处：《粉末冶金技术》2000年第4期265-269,共5页Powder Metallurgy Technology

摘　　要：研究了粉末冶金冷压—烧结法制备的WC/Cu复合材料在不同温度和时间烧结时的组织变化及WC含量对烧结过程的影响 ,分析了该材料的烧结过程。结果表明 ,WC颗粒推迟了烧结进程。烧结过程中烧结体无明显收缩 ,WC颗粒显著阻碍了晶粒长大。WC/Cu复合材料的烧结过程可分为粘结、烧结颈长大、闭孔球化。Effects of microstructure modification and influence of WC particle content on the sintering process WC reinforced copper composite made by powder metallurgy were studied after sintering at various temperature and time on. The results showed that sintered body had no obviously shrinkage after sintering, and WC particle delayed the sintering process and resisted the growth of grains. The sintering process could be divided into four periods:adhering, sintering neck growing, close-pore spherisizing, sintering neck secondly growing.

关 键 词：粉末冶金 WC/Cu复合材料 烧结 组织 

分 类 号：TB333[一般工业技术—材料科学与工程] TF124.5[冶金工程—粉末冶金]