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机构地区:[1]中国科学技术大学高分子科学与工程系,安徽合肥230026
出 处:《功能高分子学报》2000年第4期440-441,共2页Journal of Functional Polymers
摘 要:The isothermal cure behavior of epoxy/polyamide/montmorillonite(3 wt%) system has been investigated with the dynamic torsiond vibration method at four temperatures of 53 ℃、61 ℃、77 ℃ and 78 ℃ respectively. The gel timest g of the system were determined and the apparent cure activation energy E a was etimated with Flory’s gelation theory, E a=56.8 kJ/mol.The two cure processes in epoxy/polyamide/clay (3 wt%) system were observed, they are eltragallery cure process and intergallery one, which is influenced by the intercalating agent of hexadecyl trimethyl ammonium bromide in epoxy resin.The isothermal cure behavior of epoxy/polyamide/montmorillonite(3 wt%) system has been investigated with the dynamic torsiond vibration method at four temperatures of 53 ℃、61 ℃、77 ℃ and 78 ℃ respectively. The gel timest g of the system were determined and the apparent cure activation energy E a was etimated with Flory's gelation theory, E a=56.8 kJ/mol.The two cure processes in epoxy/polyamide/clay (3 wt%) system were observed, they are eltragallery cure process and intergallery one, which is influenced by the intercalating agent of hexadecyl trimethyl ammonium bromide in epoxy resin.
关 键 词:环氧树脂 蒙脱土 动态扭振 插层聚合物 二次固化
分 类 号:TB332[一般工业技术—材料科学与工程] O633.13[理学—高分子化学]
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