Microstructures and mechanical properties of electroplated Cu-Bi coatings  

铜-铋电镀涂层的结构和力学性能(英文)

作　　者：魏晓金[1] 陈为为[1] 王宇鑫[1] 郑思琳[1,2] 高唯[1] 

机构地区：[1]奥克兰大学化学与材料工程系 [2]马来亚大学机械工程系

出　　处：《Transactions of Nonferrous Metals Society of China》2013年第10期2939-2944,共6页中国有色金属学报（英文版）

基　　金：Bright Sparks Unit,University Malaya for the financial support

摘　　要：Electroplating has been used to produce Cu-Bi coatings. The crystal structure and lattice parameters of Cu in Cu-Bi composite coating were measured and compared with Cu coating. The mechanical properties of the coatings were also studied. It was found that the deposition parameters have significant effect on the mechanical properties of the Cu-Bi coatings. The microhardness has been improved from HVso165 of Cu coating to HVs0 250 of Cu-Bi composite coating prepared at 50 mA/cm2 for 20 min. Correspondingly, wear resistance of the Cu-Bi composite coating has also been enhanced significantly.采用电镀方法制备铜-铋复合涂层。由于铋在铜中的溶解度极低,因此涂层具有两相混合结构。研究铜在铜-铋复合涂层中的晶体结构和晶格参数,测试涂层的力学性能,并与铜涂层进行了比较。结果表明,电镀参数对涂层的力学性能影响较大。在电流密度为50 mA/cm2,电镀时间为20 min时,铜涂层的硬度为HV50165,而铜-铋复合涂层的硬度提高到HV50250;铜-铋复合涂层的耐磨性也相应提高。

关 键 词：Cu-Bi coating composite coating MICROHARDNESS coefficient of friction ELECTROPLATING 

分 类 号：TG174.4[金属学及工艺—金属表面处理]