硫酸盐体系三价铬硬铬电镀工艺研究  

Research on Process of Hard Chromium Electroplating with Trivalent Chromium Sulfate Electrolyte

作　　者：侯蔚 丁运虎[2] 李家柱[3] 毛祖国[2] 孙宁 韩方丁 

机构地区：[1]中国兵器工业新技术推广研究所,北京100089 [2]武汉材料保护研究所,湖北武汉430030 [3]北京蓝丽佳美化工科技中心,北京100096

出　　处：《新技术新工艺》2013年第11期89-92,共4页New Technology & New Process

摘　　要：通过赫尔槽试验、小槽试验和中试试验,确定了硫酸盐体系三价铬硬铬电镀溶液活性配位体和催化剂的组成和含量,以及镀液的工艺规范,并对镀液和镀层性能进行了测试。结果表明,镀液稳定性好,电流密度范围可达35~50 A/dm2,电流效率为29.8%~34.1%,镀层接合力优良,外观均匀白亮,厚度〉40μm,硬度达到996.5 HV,中性盐雾试验〉200 h。The composition and concentration including active ligands,catalysts,and the electroplating,process specifi-cations of the hard trivalent chromium sulfate electrolyte were determined by Hull Cell tests,electroplating simulated tests and pilot tests.The properties of the electroplating bathes and the deposits were also measured.The results showed that the process had the advantages of high stabilization,range of current density was up to 35 ~50 A/dm2 ,current efficiency was up to 29.8%~34.1%,the deposit had quality adhesive strength,appearance of uniform bright white,thickness reached more than 40 μm,hardness was up to 996.5 HV,neutral salt spray test reached more than 200 h.

关 键 词：硫酸盐体系 三价铬硬铬电镀 活性配位体 催化剂 

分 类 号：TQ153.11[化学工程—电化学工业]