电路板ENEPIG表面涂覆工艺实验  

Experimental Research of ENEPIG Surface Coating Technology of Printed Circuit Board

作　　者：于金伟[1] 

机构地区：[1]潍坊学院,山东潍坊261061

出　　处：《实验室研究与探索》2013年第10期28-31,共4页Research and Exploration In Laboratory

基　　金：国家星火计划项目(2011GA740047);山东省自然科学基金项目(ZR2012EML03);山东省国际科技合作计划项目(201013);山东省高等学校科技计划项目(J12LA57);山东省科技发展计划项目(2011YD16019);山东省潍坊市科学技术发展计划项目(20121115)

摘　　要：在ENEPIG表面涂覆新工艺中引入了化学镀钯层,从反应原理上杜绝了镀镍层的氧化,在化学镀金过程中阻挡了镀镍层与浸金溶液的接触、镍的扩散和迁移,从而有效地抑制镍表层的氧化,防止"黑垫"缺陷产生。给出了该工艺量产的流程及参数控制,运用SEM和EDS对产品进行了微观形貌及扩散性分析。结果发现,钯层是非结晶状的皮膜,具有很好的镀层厚度均一性,并且在金表面没有发现镍的扩散。从而成功地实现了ENEPIG电路板的量产,替代了ENIG工艺。In the protection method for printed circuit board welding board, one widely used coating technology is ENIG, but the coating often appears ＂black mat＂ which is due to fatal flaw in the welding process. In order to solve this problem, the engineers and technicians have taken various methods such as strict control parameter, despite the improvement, but these all have not eradicated ＂ black mat＂. Electroless palladium layer, a new technology, is introduced in ENEPIG surface coating. In the process, immersion gold blocked off nickel-plate contacts with immersion gold solution, and effectively prevents pervasion and migration of nickel. Thus oxidation of nickel surface is effectively inhibited, and prevents the ＂black mat＂ flaw. The paper not only gives the technology production process and parameter control, but also gives the microcosmic appearance and diffusibility analysis for the products by using SEM and EDS. The results show that palladium layer is non-crystalline film with good uniformity of coating thickness, and does not find pervasion of nickel on gold surface, ENEPIG printed circuit board mass production is successfully achieved, and the ENIG technology is replaced.

关 键 词：化学镀镍化学镀钯与浸金工艺 工艺原理 参数控制 黑垫 

分 类 号：TG335.22[金属学及工艺—金属压力加工]