PCB吸潮爆板问题研究  

Delamination research because of moisture absorption

作　　者：吕永[1] 王春艳[1] 邸桂娟 

机构地区：[1]天津普林电路股份有限公司,天津300250

出　　处：《印制电路信息》2013年第11期34-37,41,共5页Printed Circuit Information

摘　　要：文章主要针对PCB在制作过程中吸潮以及成品板吸潮导致的爆板进行分析探讨。文中展示了板边、板内以及半堵孔等不同原因造成的爆板类型,通过Tg测试、湿气含量测试等不同方法验证PCB是否吸潮,并根据不同的成因制定改善措施。This article analyzed causes of moisture absorption in process and finished boards which resuhed in delamination. The article demonstrated different types of delamination, such as located at the fringe and center of the board, semi phig-hole delamination and so on. It also provided the improving measure according to the dilTerent causes which is tested through TG, moisture content and other test methods.

关 键 词：吸潮 爆板 湿气含量 

分 类 号：TN41[电子电信—微电子学与固体电子学]