深冷处理后CuCr真空触头材料的组织性能研究  

Study on Structure and Properties of CuCr Vacuum Contact Material After Cryogenic Treatment

作　　者：王秀敏[1] 韩会民[1] 丛吉远 王玉魁 

机构地区：[1]大连理工大学材料系,辽宁大连116024

出　　处：《金属热处理学报》2000年第4期57-61,共5页

基　　金：国家自然科学基金资助! ( 5 97770 10 )

摘　　要：CuCr50真空触头材料经深冷处理后 ,抗电弧烧蚀性能明显提高。本文利用电子探针、能谱、显微硬度测试等手段 ,对CuCr50合金深冷处理前后的显微组织和性能进行了对比分析。结果表明 :CuCr50合金深冷处理后 ,显微孔洞明显减少 ,Cu基体孪晶增多 ,表面出现弥散分布的细小Cr颗粒。说明在深冷过程中 ,显微孔洞焊合 ,致密性增加 ,Cu基体的纯度增加 ,电极导热性、导电性随之增加。After cryogenic treatment,the resistance property of arc erosion of CuCr50 vacuum contact material change dramatically.In this paper,comparison and analysis have been studied on microstructure and properties of CuCr50 alloy before and after cryogenic treatment by means of electronic probe,energy spectrum and microhardness.The results show that after cryogenic treatment,the small dispersed chromium particles appear on the surface of matrix accompanied by distinct diminution of micropores and increasment of twins in copper matrix.Such changes of structure and properties could greatly improve the resistance ability of arc erosion and the switching ability of vacuum switch.

关 键 词：深冷处理 铜铬合金触头 显微组织 电弧烧蚀 

分 类 号：TM241[一般工业技术—材料科学与工程] TG166.291[电气工程—电工理论与新技术]