基于烟囱效应的集成封装半导体照明光源散热结构优化设计  

Optimization of Heat Sink Design Based on Chimney Effect for Integrated Packaging Semiconductor Lighting Source

作　　者：张国旺[1] 韩彦军[1] 罗毅[1,2] 李洪涛[1] 

机构地区：[1]清华大学电子工程系清华信息科学技术国家实验室筹,北京100084 [2]深圳研究生院半导体照明实验室,广东深圳518057

出　　处：《半导体光电》2013年第5期732-737,共6页Semiconductor Optoelectronics

基　　金：国家科技支撑计划项目(2011BAE01B07,2012BAE01B03);广东省科技计划项目(2011A081301003);北京市自然科学基金项目(4091001);集成光电子学国家重点联合实验室开放课题(IOSKL2012KF09);国家“973”计划项目(2012CB315605,2011CB301900);国家“863”计划项目(2011AA03A112,2011AA03A106,2011AA03A105);国家自然科学基金项目(61176015,60723002,61176059,60977022,51002085)

摘　　要：针对基于集成封装发光二级管(COB LED)的半导体照明光源,研究了引流孔的形状、尺寸和位置等对基于烟囱效应的散热器的散热特性的影响。CFD仿真模拟表明,对于50W热功率的COB LED散热结构,在导热板上形成两个面积为15cm2、以光源中心对称的矩形引流孔,可在保持COB LED最高温度小于52℃的条件下,将基于烟囱效应的散热器的重量进一步降低15%。实验结果与模拟结果基本一致。For semiconductor lighting source based on integrated packaging light-emitting diode （COB LED）, the effects of shape, size and distribution of air conducting holes on the heat dissipation characteristics of chimney effect based heat sink are studied. It is indicated by CFD simulations that, for the heat dissipation structure of COB LED of 50 W thermal power, by forming two rectangular air conducting holes of 15 cm2 symmetrically to the center of lighting source on the thermally conducting plate, the weight of the chimney effect based heat sink is further reduced by 15% while keeping the temperature of COB LED below 52 ~C. Experimental results and simulation results are basically consistent.

关 键 词：COB LED 散热设计 烟囱效应 引流孔 

分 类 号：TN312.8[电子电信—物理电子学]