镍磷合金表面电化学蚀刻层的性能表征  

Performance Characterization of Electrochemical Etching Coating on Ni-P Alloy

作　　者：许斌[1,2] 邹洪庆[1,2] 

机构地区：[1]西南技术工程研究所,重庆400039 [2]国防科技工业自然环境试验研究中心,重庆400039

出　　处：《表面技术》2013年第6期18-22,共5页Surface Technology

摘　　要：目的研究镍磷合金镀层经电化学蚀刻后的表面特性。方法对镍磷合金镀层进行电化学蚀刻,表征蚀刻层的外观形貌、显微形貌、物相结构、元素成分及蚀刻深度,测定蚀刻层的硬度,通过热震试验测试蚀刻层的结合强度,通过极化曲线表征蚀刻微孔的穿透性。结果电化学蚀刻后,镍磷合金层表面会逐渐失光,颜色变暗。电化学蚀刻微孔最初在胞状物边界产生,随后扩展至胞状物表面。结论在较佳的蚀刻条件下,蚀刻层微孔大小合适,均匀分布,且孔深合适,没有微孔穿透至基底层。电化学蚀刻使表面硬度有所下降,而对蚀刻层的结合强度影响不大。Objective The characteristics of Ni-P alloy coating after electrochemical etching were investigated. Methods Ni-P alloy coating was etched by the electrochemical etching method. The surface, microstructure, phase composition, elementary composition and etching depth were characterized. The hardness of etching coating was tested by the microhardness tester. The binding strength between etching coating and substrate was tested by thermal shock technology. The penetration of etching micropores was characterized by using polarization curves. Results The results showed that： the surface of Ni-P alloy after electrochemical etching would turn tarnish and dark. The electrochemical etching micropores first appeared on borders of the cellular materials, then spread to the surface of cellular materials. The etching micropores were in right size and distributed evenly under optimal conditions of electrochemical etching. The etching micropore didn＇ t penetrate the Ni-P alloy layer to the substrate. Conclusion The electrochemical etch- ing had little effect on the binding strength, but reduced the hardness of the etching layer.

关 键 词：镍磷合金镀层 电化学蚀刻 多孔蚀刻层 

分 类 号：TG175[金属学及工艺—金属表面处理]