一种新型片式固体钽电容器成型粘合剂的研究  

Research on a New Kind of Mould Pressing Binder for Producing Chip Solid Tantalum Capacitors

作　　者：吴代娟[1] 罗桂甫[1] 

机构地区：[1]湖南化工职业技术学院,湖南株洲412004

出　　处：《辽宁化工》2013年第11期1278-1279,1283,共3页Liaoning Chemical Industry

摘　　要：新研究出的EOX粘合剂，可取消片式固体钽电容器生产过程的预焙烧工序，并使每批产品生产周期缩短10-12h，可节约电耗、物耗、劳动力消耗；EOX粘合剂的脱除原理简单，其作为杂质蒸发脱除。EOX作粘合剂使用可将产品的漏电流降低50％，60％，提高了产品质量。并随着钽阳极基体结构和内应力的改善，片式固体钽电解电容器的电性能亦得到改善。A new EOX binder for mould pressing of chip solid tantalum capacitors was prepared. To use the binder can cancel the pre-vacuum sintering process and cut down the production cycle by 10~12 h, which can save the electric consumption, material consumption and labor force consumption. The principle of detaching the EOX binder is simple; it can be evaporated as impurity. Using EOX as binder can bring down the leakage current by 50%~60% and greatly improve the product quality. With the improvement of positive tantalum electrode＇s structure and internal stress, the electrical characteristics of chip solid tantalum capacitor can be also improved.

关 键 词：片式固体钽电容器 EOX 成型 粘合剂 

分 类 号：TQ430[化学工程]