激光电化学复合加工的温度场与电场模拟研究  

Simulation Research of Temperature Field and Electric Field in Laser Electrochemical Compound Processing

作　　者：印洁[1] 张朝阳[1] 曾永彬[2] 李中洋[1] 秦昌亮[1] 

机构地区：[1]江苏大学机械工程学院激光技术研究所,江苏镇江212013 [2]南京航空航天大学江苏省精密与微细制造技术重点实验室,江苏南京210016

出　　处：《激光与光电子学进展》2013年第12期129-137,共9页Laser & Optoelectronics Progress

基　　金：国家自然科学基金(50975127;51275218);江苏省自然科学研究基金(BK2011522);江苏省精密与微细制造技术重点实验室开放基金(BM2012009);江苏大学第11批学生科研课题(11A380)

摘　　要：激光电化学复合微加工技术将激光能量与电化学加工相结合,利用激光的热-力学效应和电极反应去除工件材料,实现选择性定域刻蚀加工。针对激光电化学复合加工中的多能量场耦合特点,利用有限元分析软件ANSYS对复合刻蚀加工靶材的瞬态温度场和电场进行了有限元数值模拟,研究了温度、电场变化对复合加工区域范围及加工深度的影响;并与试验结果对比,分析了激光电化学去除材料、刻蚀成形的机理,探讨了激光电化学微细加工所得表面形貌的特征。Laser electrochemical compound etching, combining laser energy and electrochemical etching processing, removes the workpiece material by using the thermal-mechanical effect of laser and electrode reaction, and achieves the selective localized etching processing. For the multiple-field coupling characteristics of laser electrochemical compound processing, the finite element analysis software ANSYS is used to perform finite element numerical simulation of transient temperature field and electric field of the compound etching target material. The influence of changes in the transient temperature field and electric field on the scope and depth of processing area is studied. By comparing the results with experimental ones, the laser electrochemical mechanism of material removal and etching forming is shown. The surface topography characteristic of the micro-machining process in laser electrochemical compound processing is discussed, which provides the guidance for the optimization of compound processing technology.

关 键 词：激光技术 激光电化学 复合加工 ANSYS 温度场 电场 

分 类 号：TG665[金属学及工艺—金属切削加工及机床]