一种大功率LED模组的热管理设计  

A Design of Management of High-Power LED Module Heat Dissipation

作　　者：严荣添 罗婉霞 梁德卓 

机构地区：[1]广州广日股份有限公司,广东广州510623

出　　处：《机电工程技术》2013年第11期43-45,共3页Mechanical & Electrical Engineering Technology

摘　　要：由于大功率LED模组在工作时会产生大量热量并导致LED结温上升,对LED模组寿命产生严重影响,大功率LED模组的热管理问题成为了行业的研究重点。通过对封装和热管技术研究,提出了COB与热管技术结合的热管理设计。通过研究发现,该热管理设计能有效提高散热效率,满足了大功率LED模组散热要求。High-power LED module produces a lot tff heat when lighting , which causes rise of LED junction temperature anti very strong wol.＇se impact on the lifetime of LED module. The management of higb-puwer LED modnle heat dissipation beeomes res^arch foetus of the industry. This paper based on the study in the technology of encapsulation and heat pipe, puts fbrward a design of management of heat dissipation with combination of COB and heat pipe. The study shows that the design of management of heat dissipation can meet the requirement of high-power LED module heat dissipation witb high efficiency ~ff heat dissipation.

关 键 词：大功率LED模组 COB 热管 热管理 

分 类 号：TM923[电气工程—电力电子与电力传动]