电子封装用Al_2O_3改性环氧树脂及其性能  

Preparation and Properties of Al_2O_3-Modified Epoxy Resin for Electronic Packaging

作　　者：刘长岭[1] 杨宁[1] 张泽宇[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,长春130033

出　　处：《应用化学》2013年第12期1417-1422,共6页Chinese Journal of Applied Chemistry

摘　　要：将不同粒径和形状的Al2O3混合颗粒填充到液态环氧树脂中，研究了单一粒径、二元混合粒径和多元混合粒径填充对固化环氧树脂复合材料的热导率、热膨胀系数和介电常数的影响。通过分形理论探讨了填料的密堆积与复合材料导热性能的关系。结果表明，单一片状及直径48μm的粒状Al2O3填充环氧树脂复合材料，具有较好的综合性能；对二元混合粒径填料，小粒子用量占填料总体积的20％-40％之间时，获得的复合材料的热导率、介电常数和热膨胀系数均能达到最佳值；混合粒子中粒径分布的分数维D值在某一适宜区间时，不同粒径的粒子之间可形成空隙率相对最小的紧密堆积，从而可获得热导率相对较高的复合材料。Thermal conductivity, thermal expansion coefficient and dielectric constant of liquid epoxy resin filled with Al2O3 flakes or particles in single, binary or multiple hybrid particle sizes were investigated. The relationship between enhanced thermal performance and dense packing was studied by the fractal theory. The results show that the modified epoxy resin filled with single Al2O3 flakes or particles（ -48 μm） exhibit superior comprehensive performance. The best thermal conductivity, dielectric constant and thermal expansion coefficient are obtained when the epoxy resin filled with the binary hybrid particles, where the volume fraction of the smaller particles in the mixed particles is 20% - 40%. The particles in various sizes in a close packing pattern form the relatively minimum gap and the highest relative thermal conductivity is obtained when the fractal dimension D value of hybrid particle size is in a suitable range.

关 键 词：AL2O3 粒径形态 改性环氧树脂 热导率 热膨胀系数 介电常数 分形理论 

分 类 号：O631.2[理学—高分子化学]