复合材料胶粘剂固化反应及工艺参数的研究  

STUDY OF CURING REACTION AND TECHNOLOGY PARAMETERS OF COMPOSITE ADHESIVE

作　　者：高家武[1] 

机构地区：[1]北京航空航天大学,北京100083

出　　处：《复合材料学报》1991年第2期71-76,共6页Acta Materiae Compositae Sinica

摘　　要：本文用PERKIN-ELMER公司(简称P-E公司)的DSC-7仪器测定了SY—25胶膜的固化反应。根据DSC测试原理建立的动力学方程,通过DSC—7动力学软件,求出SY-25胶膜的固化反应动力学参数-固化反应表观活化能(E_a)、反应级数(n)以及表观频率因子(Z)。利用已得到的动力学参数值,进一步预测SY-25胶膜的固化反应程度(α)、固化反应温度(Tc)以及固化反应时间(t)等三者之间的关系,为合理制定SY-25胶膜的固化工艺参数提供理论数据。The paper is about measuring curing reaction of SY-25 adhesive by usingDSC-7 of PERKIN-ELMER Company. Kinetic parameters of curing reaction of SY-25 adhesive such as curing reaction activation energy, reaction order and pro-exponential factor can be obtained based on the kinetic equation which is constructed in accordance with the measuring principle of DSC-7. Using the kinetic parameters, the relationship among degree of curing, curing tempera-ture and curing time is predicted.This work may be used to proviole a theore-tical data for making curing technology parameters of SY-25 adhesive.

关 键 词：复合材料 胶粘剂 固化反应 参数 

分 类 号：TQ433.4[化学工程]