一种高速化学镀Ni-Cu-P合金工艺  

A High-speed Electroless Ni-Cu-P Alloy Plating Technique

作　　者：刘铁虎[1] 王毅坚[1] 

机构地区：[1]吉林化工学院,吉林132022

出　　处：《表面技术》2000年第6期43-46,共4页Surface Technology

摘　　要：开发一种高速化学镀 Ni- Cu- P合金工艺 ,研究了镀液中 Cu SO4 · 5H2 O浓度、p H值、温度对镀层成分、镀速的影响 ,并根据 GB10 12 4 - 88标准对镀层作了耐蚀性试验。结果表明 ,本工艺在各参数较大的变化范围内均可获得较高的镀速 ,最高镀速可达 2 8μm/ h,而且镀层具有较好的耐蚀性 ,该工艺条件下获得的镀层在 50 % H2 SO4 (室温 )和 50 % Na OH(95℃ )中的耐蚀性远高于 1Cr18Ni9Ti、1Cr18Ni12 Mo2 Ti等不锈钢、碳钢以及 Ni- P化学镀层。A high speed electroless Ni Cu P alloy technique has been developed,and the effects that all the technological parameters(the concentration of CuSO 4·5H 2O in the plating bath,pH value,and temperature) have on the composition of plating film and on the plating speed have been studied.The corrosion resistance of the plating film has been tested in accordance with the GB 10124 88 standard.It has proved that this technique can ensure relatively high plating speed within a wide range of parameter changes.The highest plating speed can reach 28μm/h,and the plating film has a better corrosion resistance.The corrosion resistance of the Ni Cu P plating film in the 50% H 2SO 4(at the room temperature)and the 50% NaOH(95℃)is much higher than that of the stainless steel(such as 1Cr18Ni9Ti,1Cr18Ni12Mo2Ti,etc.),carbon steel as well the Ni P plating film.

关 键 词：化学镀 镀速 耐蚀性 镍铜磷合金 镀层 

分 类 号：TQ153.2[化学工程—电化学工业]